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Auto bender series
ZY-510CA Automatic Rule Bending Machine
ZY-510B General type auto bender
ZY-510C Fully auto bender
ZY-100 Creasing machine
ZY-510A precision auto bender
Laser cutting machine series
ZY1218-1500W Laser cutting machine
ZY1218-1000W Laser cutting machine
ZY1218-300W GSI laser cutting machine
ZY-1530High power laser cutting machine
ZY1218-400W Laser cutting machine
LED bonder series
ZY-270AGeneral high speed LED Bonder
ZY-270BMulti-function LED bonder
ZY-270C Up-down feeding LED bonder
K-200 IC high speed Bonder
K-100 IC high speed bonder
 
     
 
HUAZHENGYUAN > Products > LED bonder series
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ZY-270BMulti-function LED bonder
多功能高速固晶机
ZY-270BMulti-function LED bonder   ZY-270BMulti-function LED bonder    
Intro Download Video

ZY-270B泛用型高速固晶机
主要技术参数:

操作系统:

XP
操作界面: 中文界面17寸彩色显示屏.
工作周期时间: 220MSEC左右
角度精度: ±5
定位精度: ±1.5mil
芯片尺寸: 6mil-100mil*100mil
支架类型: LED,SMD,PCB,点阵,食人鱼及大功率.
定位系统: 双视觉系统.
供电电压: 220v±10v,50HZ
消耗功率: 1.3KW/小时
正压源: 3-5kgf/cm
负压源: -80-90kpa
固晶系统 260mm*140mm
固晶头: 表面吸取式
固晶臂: 90度旋转
固晶力度: 20G-210G(可调)
芯片XY工作台
最大行程: 120mm*200m(±12)
精确度: ±0.3mil
复测精度: ±0.2mil
芯片环尺寸: 6’或4’
顶针行程: 4mm最高
固晶工作台  
最大XY行程 10’*6’
精度: ±0.3mil
重复性: ±0.2mil
点胶臂: 30度旋转
其他功能及配置  
漏晶检测和自动清洗吸嘴功能  
无限程度储存数量  
17寸彩色显示屏  
外置式真空系统  
 
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